US 11,917,272 B2
Imaging systems for multi-spectral imaging
Orit Skorka, Santa Clara, CA (US); Paul James Kane, Rochester, NY (US); and David Wayne Jasinski, San Jose, CA (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Oct. 28, 2020, as Appl. No. 16/949,384.
Prior Publication US 2022/0132089 A1, Apr. 28, 2022
Int. Cl. H04N 23/11 (2023.01); H04N 9/64 (2023.01); H04N 17/00 (2006.01); H04N 23/10 (2023.01); H04N 23/80 (2023.01); H04N 23/84 (2023.01); G02B 5/20 (2006.01)
CPC H04N 23/11 (2023.01) [H04N 9/64 (2013.01); H04N 17/002 (2013.01); H04N 23/10 (2023.01); H04N 23/80 (2023.01); H04N 23/84 (2023.01); G02B 5/20 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An imaging system comprising:
an image sensor that includes infrared pixels; and
color processing circuitry that includes a standard color processing pipeline and infrared-marking circuitry, wherein the infrared-marking circuitry comprises:
hue angle determination circuitry, wherein the standard color processing pipeline is interposed between the image sensor and the hue angle determination circuitry,
cell means determination circuitry, and
near-infrared determination circuitry.