	US 11,916,533 B2
	Surface acoustic wave devices and related methods
Michio Kadota, Sendai (JP); Shuji Tanaka, Sendai (JP); and Hiroyuki Nakamura, Kadoma (JP)
Filed by TOHOKU UNIVERSITY, Sendai (JP); and SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Jun. 7, 2022, as Appl. No. 17/834,391.
Application 17/834,391 is a continuation of application No. 17/021,125, filed on Sep. 15, 2020, granted, now 11,356,075.
Claims priority of provisional application 62/901,202, filed on Sep. 16, 2019.
Prior Publication US 2022/0385264 A1, Dec. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01)

CPC H03H 9/02551 (2013.01) [H03H 3/08 (2013.01); H03H 9/14541 (2013.01); H03H 9/6406 (2013.01)]

16 Claims

1. A radio-frequency filter comprising:

an input node for receiving a signal;

an output node for providing a filtered signal; and

a surface acoustic wave device implemented to be electrically between the input node and the output node, the surface acoustic wave device configured to provide resonance of a surface acoustic wave having a wavelength λ and including a quartz substrate and a piezoelectric plate formed from LiTaO₃or LiNbO₃and disposed over the quartz substrate, the piezoelectric plate having a thickness greater than 2λ, the surface acoustic wave device further including an interdigital transducer electrode formed over the piezoelectric plate, the interdigital transducer electrode having a mass density ρ in a range 1.50 g/cm³<ρ≤6.00 g/cm³, 6.00 g/cm³<ρ≤12.0 g/cm³, or 12.0 g/cm³<ρ≤23.0 g/cm³, and a thickness greater than 0.148λ, greater than 0.079λ, or greater than 0.036λ, respectively.