CPC H01L 23/49568 (2013.01) [H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/4012 (2013.01); H01L 23/49503 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 25/043 (2013.01); H01L 25/0655 (2013.01); H01L 25/0756 (2013.01); H01L 2924/181 (2013.01); H02P 27/06 (2013.01); H02P 2201/03 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
a carrier including an electronic circuit;
a plurality of semiconductor chip packages mounted on the carrier, wherein each of the chip packages includes an encapsulation encapsulating the semiconductor chip, a plurality of contact structures electrically connecting the semiconductor chip with the electronic circuit, and at least one cooling structure protruding from the encapsulation; and
a cooling element thermally conductively connected to at least one cooling structure of each of at least two of the plurality of semiconductor chip packages.
|