US 11,915,999 B2
Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element
Tomasz Naeve, Finkenstein (AT); Ralf Otremba, Kaufbeuren (DE); Thorsten Scharf, Lappersdorf (DE); Markus Dinkel, Unterhaching (DE); Martin Gruber, Schwandorf (DE); and Elvir Kahrimanovic, Villach (AT)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jan. 31, 2023, as Appl. No. 18/103,865.
Application 18/103,865 is a continuation of application No. 16/845,304, filed on Apr. 10, 2020, granted, now 11,600,558.
Claims priority of application No. 102019109746.0 (DE), filed on Apr. 12, 2019; and application No. 102020106492.6 (DE), filed on Mar. 10, 2020.
Prior Publication US 2023/0187326 A1, Jun. 15, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01); H01L 25/065 (2023.01); H01L 25/075 (2006.01); H01L 25/04 (2023.01); H02P 27/06 (2006.01)
CPC H01L 23/49568 (2013.01) [H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/4012 (2013.01); H01L 23/49503 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 25/043 (2013.01); H01L 25/0655 (2013.01); H01L 25/0756 (2013.01); H01L 2924/181 (2013.01); H02P 27/06 (2013.01); H02P 2201/03 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a carrier including an electronic circuit;
a plurality of semiconductor chip packages mounted on the carrier, wherein each of the chip packages includes an encapsulation encapsulating the semiconductor chip, a plurality of contact structures electrically connecting the semiconductor chip with the electronic circuit, and at least one cooling structure protruding from the encapsulation; and
a cooling element thermally conductively connected to at least one cooling structure of each of at least two of the plurality of semiconductor chip packages.