US 11,915,993 B2
Two-pack curable composition set, thermally conductive cured product, and electronic device
Masahiro Kato, Gunma (JP)
Assigned to Denka Company Limited, Tokyo (JP)
Appl. No. 17/285,441
Filed by Denka Company Limited, Tokyo (JP)
PCT Filed Oct. 10, 2019, PCT No. PCT/JP2019/040087
§ 371(c)(1), (2) Date Sep. 15, 2021,
PCT Pub. No. WO2020/080256, PCT Pub. Date Apr. 23, 2020.
Claims priority of application No. 2018-194637 (JP), filed on Oct. 15, 2018.
Prior Publication US 2021/0407885 A1, Dec. 30, 2021
Int. Cl. F23L 15/02 (2006.01); F28D 17/00 (2006.01); H01L 23/373 (2006.01); C08K 3/36 (2006.01); C08L 83/04 (2006.01)
CPC H01L 23/3737 (2013.01) [C08K 3/36 (2013.01); C08L 83/04 (2013.01); C08K 2201/001 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A two-pack curable composition set comprising:
a first agent comprising an organopolysiloxane having a branched structure and having a vinyl group at least at an end or in a side chain, a thermally conductive filler, a silica powder, and a platinum catalyst, and having a viscosity at 25° C. at a shear rate of 10 s−1 of 20 to 150 Pa·s; and
a second agent comprising an organopolysiloxane having a branched structure and having a vinyl group at least at an end or in a side chain, and a polydimethylsiloxane having a hydrosilyl group at least at an end or in a side chain, a thermally conductive filler, and a silica powder, and having a viscosity at 25° C. at a shear rate of 10 s−1 of 20 to 150 Pa·s.