US 11,915,990 B2
Method for manufacturing a power module unit
Daniel Kappauf, Gräfenberg (DE); Stanislav Panicerski, Nuremberg (DE); and Jens Schmenger, Forchheim (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Appl. No. 17/802,396
Filed by Siemens Aktiengesellschaft, Munich (DE)
PCT Filed Jan. 14, 2021, PCT No. PCT/EP2021/050622
§ 371(c)(1), (2) Date Aug. 25, 2022,
PCT Pub. No. WO2021/170308, PCT Pub. Date Sep. 2, 2021.
Claims priority of application No. 20160146 (EP), filed on Feb. 28, 2020.
Prior Publication US 2023/0131848 A1, Apr. 27, 2023
Int. Cl. H01L 23/367 (2006.01); B21D 53/02 (2006.01); H01L 21/48 (2006.01); B23D 53/02 (2006.01); B23P 15/26 (2006.01); F28F 3/02 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/3672 (2013.01) [B21D 53/02 (2013.01); H01L 21/4878 (2013.01); H01L 21/4882 (2013.01); B23D 53/02 (2013.01); B23P 15/26 (2013.01); F28F 3/02 (2013.01); H05K 7/2039 (2013.01)] 14 Claims
OG exemplary drawing
 
8. A method of manufacturing a power module unit, said method comprising:
positioning cooling fins in recesses of a frame, in particular a metal frame;
applying a first metallic material to the cooling fins and the frame by a thermal spraying process, causinq the applied first metallic material to produce milling off a first surface flat after the first metallic material has been applied;
applying a dielectric substrate to the first surface by a thermal spraying process;
applying a second metallic material to the dielectric substrate; and milling off a second surface of the second metallic material flat after applying the second metallic material to the dielectric substrate.