CPC H01L 21/823437 (2013.01) [H01L 21/823431 (2013.01); H01L 21/823481 (2013.01); H01L 27/0886 (2013.01)] | 20 Claims |
1. A device comprising:
a first fin structure and a second fin structure disposed over a substrate;
a dielectric isolation structure disposed on the substrate and extending from the first fin structure to the second fin structure;
a first interlayer dielectric layer disposed on the first fin structure and the second fin structure;
a first material layer disposed directly on the first interlayer dielectric layer;
a second material layer disposed directly on the first material layer, the second material being formed of a different material than the first material layer; and
a second interlayer dielectric layer extending through the second material layer, the first material layer, the first interlayer dielectric layer and a portion of the dielectric isolation structure, and wherein the second interlayer dielectric layer is formed of a different material than the first interlayer dielectric layer, and wherein a top surface of the second material layer is covered by the second interlayer dielectric layer, the top surface of the second material layer facing away from the substrate.
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