US 11,915,959 B2
Substrate treatment apparatus and transfer schedule creation method
Kenichirou Matsuyama, Koshi (JP); and Yuichiro Kawasaki, Koshi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jul. 29, 2021, as Appl. No. 17/388,195.
Claims priority of application No. 2020-133022 (JP), filed on Aug. 5, 2020.
Prior Publication US 2022/0044953 A1, Feb. 10, 2022
Int. Cl. H01L 21/677 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67745 (2013.01) [H01L 21/6773 (2013.01); H01L 21/67276 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate treatment apparatus for treating a substrate, comprising:
a plurality of treatment parts each configured to perform a predetermined treatment;
a transfer mechanism configured to transfer a transfer object, a plurality of transfer objects being transferred in a predetermined transfer-in order into the substrate treatment apparatus; and
a controller configured to acquire a process job for transferring the transfer object by the transfer mechanism to at least one of the treatment parts and performing the treatment on the transfer object, wherein
the controller is configured to determine before starting transfer of one transfer object to the treatment part, when the process job is different between the one transfer object and a preceding transfer object transferred into the substrate treatment apparatus prior to the one transfer object and a same kind of treatment is included in the respective process jobs thereof a possibility of performing preceding execution of executing the same kind of treatment on the one transfer object previous to completion of the same kind of treatment on the preceding transfer object.