| CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01)] | 9 Claims |
|
1. A multilayer electronic component comprising:
a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and
external electrodes disposed on the body,
wherein each of the external electrodes includes an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin,
wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed, and the conductive resin layer does not include Ag except for Ag disposed on the surface of the second conductive particle.
|