US 11,914,200 B2
Systems using fan-in and fan-out microLED-based interconnects
Bardia Pezeshki, Sunnyvale, CA (US); Robert Kalman, Sunnyvale, CA (US); and Alex Tselikov, Sunnyvale, CA (US)
Assigned to AvicenaTech Corp., Sunnyvale, CA (US)
Filed by AvicenaTech Corp., Sunnyvale, CA (US)
Filed on Jan. 8, 2021, as Appl. No. 17/145,096.
Claims priority of provisional application 62/960,543, filed on Jan. 13, 2020.
Claims priority of provisional application 62/958,615, filed on Jan. 8, 2020.
Prior Publication US 2021/0208346 A1, Jul. 8, 2021
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4204 (2013.01) 2 Claims
OG exemplary drawing
 
1. An optically-interconnected integrated circuit (IC) architecture, comprising:
a first plurality of memory ICs;
a plurality of sets of microLEDs, each set of the microLEDs being associated with and configured to be driven with signals from a corresponding one of the first plurality of ICs;
a second silicon processor IC;
a plurality of photodetectors associated with and configured for provision of signals to the second IC;
a plurality of sets of input waveguides, each set of the input waveguides being associated with and positioned to receive optical signals from each set of the microLEDs corresponding to one of the first plurality of ICs and to provide optical signals to different fan-in regions, wherein each fan-in region has a plurality of input waveguides combined to have a single output; and
a plurality of output waveguides, each of the plurality of output waveguides positioned to receive optical signals from a different one of the fan-in regions and to provide optical signals to a different one of the plurality of photodetectors.