US 11,913,116 B2
Substrate processing apparatus and method of manufacturing semiconductor device
Motoya Takewaki, Toyama (JP); and Tomoshi Taniyama, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by KOKUSAI ELECTRIC CORPORATION, Tokyo (JP)
Filed on Sep. 22, 2020, as Appl. No. 17/028,530.
Application 17/028,530 is a continuation of application No. PCT/JP2018/012173, filed on Mar. 26, 2018.
Prior Publication US 2021/0002768 A1, Jan. 7, 2021
Int. Cl. H01L 21/673 (2006.01); C23C 16/52 (2006.01); C23C 16/458 (2006.01)
CPC C23C 16/52 (2013.01) [C23C 16/4584 (2013.01); H01L 21/67303 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a boat on which substrates are placed;
a process furnace comprising a reaction tube into which the boat is to be inserted and a rotator configured to rotate the boat by placing the boat on a rotating shaft when the boat is inserted in the reaction tube, wherein a film is formed on the substrates placed on the boat in the reaction tube;
a substrate transport device configured to transfer the substrates into the boat; and
a controller configured to control the substrate transport device, wherein the controller is further configured to store information on a difference between a rotation axis of the rotating shaft and a virtual center axis of the reaction tube measured in advance so that the substrates are transferred into the boat by the substrate transport device referring to the virtual center axis.