US 11,912,910 B2
Conductive film laminate and method of fabricating the same
Hyuk Hwan Kwon, Gyeonggi-do (KR); Sun Kwon Ahn, Gyeonggi-do (KR); and Chang Yong Lee, Gyeonggi-do (KR)
Assigned to DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do (KR)
Filed by DONGWOO FINE-CHEM CO., LTD., Jeollabuk-do (KR)
Filed on Mar. 25, 2021, as Appl. No. 17/211,986.
Claims priority of application No. 10-2020-0039113 (KR), filed on Mar. 31, 2020.
Prior Publication US 2021/0301181 A1, Sep. 30, 2021
Int. Cl. C09J 9/02 (2006.01); H01B 5/14 (2006.01); C09J 7/40 (2018.01); G06F 3/044 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 38/00 (2006.01)
CPC C09J 9/02 (2013.01) [B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 38/0004 (2013.01); C09J 7/403 (2018.01); H01B 5/14 (2013.01); B32B 2307/202 (2013.01); C09J 2203/326 (2013.01); G06F 3/044 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A conductive film laminate, comprising:
a carrier substrate; and
a conductive film liner on the carrier substrate; and
a conductive adhesive film formed on the conductive film liner,
wherein the conductive film liner is disposed between the carrier substrate and the conductive adhesive film, and the conductive film liner and the conductive adhesive film forms a cut pattern which does not cover the entire carrier substrate.