	US 11,912,612 B2
	Plating film and plating film production method
Mayu Tsukuda, Osaka (JP); Toshimitsu Nagao, Osaka (JP); Junichi Katayama, Osaka (JP); Kazuya Shimada, Suita (JP); Masahito Hayamizu, Suita (JP); Toshihiko Sakata, Suita (JP); Shuhei Fuku, Suita (JP); and Asuka Hirooka, Suita (JP)
Assigned to OKUNO CHEMICAL INDUSTRIES CO., LTD., Osaka (JP); and PANASONIC HOLDINGS CORPORATION, Kadoma (JP)
Appl. No. 18/031,512
Filed by OKUNO CHEMICAL INDUSTRIES CO., LTD., Osaka (JP); and PANASONIC HOLDINGS CORPORATION, Kadoma (JP)
PCT Filed Jun. 1, 2022, PCT No. PCT/JP2022/022268 § 371(c)(1), (2) Date Apr. 12, 2023, PCT Pub. No. WO2022/270253, PCT Pub. Date Dec. 29, 2022.
Claims priority of application No. 2021-105229 (JP), filed on Jun. 24, 2021; and application No. 2022-003941 (JP), filed on Jan. 13, 2022.
Prior Publication US 2023/0391664 A1, Dec. 7, 2023
Int. Cl. C03C 17/36 (2006.01)

CPC C03C 17/3618 (2013.01) [C03C 17/3639 (2013.01); C03C 17/3697 (2013.01); C03C 2217/253 (2013.01); C03C 2218/115 (2013.01)]

14 Claims

1. A method for producing a plating film to be formed on a glass substrate, comprising:

(I) step I of bringing a reaction solution containing fluorine and an oxide precursor into contact with a surface of a glass substrate to form an oxide layer on the glass substrate;

(II) step II of adding a catalyst to the oxide layer;

(III) step III of removing fluorine in the oxide layer to which the catalyst has been added;

(IV) step IV of forming an electroless plating film on the oxide layer to which the catalyst has been added; and

(V) step V of forming an electrolytic copper plating film on the electroless plating film.