US 11,912,564 B2
Sensor package including a substrate with an inductor layer
Adam Ariffin, Naperville, IL (US); and Donald Yochem, Buffalo Grove, IL (US)
Assigned to Knowles Electronics, LLC, Itasca, IL (US)
Filed by Knowles Electronics, LLC, Itasca, IL (US)
Filed on Jul. 31, 2020, as Appl. No. 16/944,362.
Prior Publication US 2022/0033248 A1, Feb. 3, 2022
Int. Cl. B81B 7/00 (2006.01); H04R 19/04 (2006.01)
CPC B81B 7/008 (2013.01) [H04R 19/04 (2013.01); B81B 2201/0221 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A microelectromechanical systems (MEMS) sensor package comprising:
a substrate including a plurality of layers including a first pair of layers and a second pair of layers different from the first pair of layers, the substrate having a first side and a second side opposite the first side;
a transducer coupled to the second side of the substrate; and
an inductor electrically coupled to the transducer, the inductor configured as a single layer trace on an inductor layer within the substrate and disposed between the first pair of layers within the substrate, where the first pair of layers is more distal from the second side of the substrate than the second pair of layers,
wherein the transducer comprises a diaphragm and a back plate,
wherein the substrate is a base including a sound port acoustically coupled to the diaphragm, where the sound port comprises an aperture running through all of the layers of the substrate,
wherein there are no other inductors between layers in a direction perpendicular to a plane of the inductor layer, and
wherein the sound port passes between traces of the inductor.