CPC B24B 53/017 (2013.01) [B24B 37/04 (2013.01); B27N 3/007 (2013.01); H01L 21/304 (2013.01); H01L 21/3212 (2013.01); H01L 21/67 (2013.01)] | 7 Claims |
1. A method of manufacturing a composite article, comprising:
providing a polishing pad including a rough surface;
providing a semiconductor structure disposed above the polishing pad;
contacting the semiconductor structure with the rough surface of the polishing pad;
rotating the semiconductor structure relative to the polishing pad to generate a semiconductor structure debris peeled off from the semiconductor structure and a polishing pad debris peeled off from the polishing pad;
collecting the polishing pad debris generated during the rotation;
providing a wood material; and
mixing the collected polishing pad debris with the wood material to form the composite article.
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