US 11,911,871 B2
Method of manufacturing composite article
Hua-Chou Chiang, Hsinchu County (TW); Chandler Ying Lai See, Hsinchu (TW); and Chung-Chieh Ko, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Feb. 26, 2019, as Appl. No. 16/285,605.
Claims priority of provisional application 62/753,302, filed on Oct. 31, 2018.
Prior Publication US 2020/0130137 A1, Apr. 30, 2020
Int. Cl. B24B 53/017 (2012.01); B24B 37/04 (2012.01); B27N 3/00 (2006.01); H01L 21/304 (2006.01); H01L 21/321 (2006.01); H01L 21/67 (2006.01)
CPC B24B 53/017 (2013.01) [B24B 37/04 (2013.01); B27N 3/007 (2013.01); H01L 21/304 (2013.01); H01L 21/3212 (2013.01); H01L 21/67 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method of manufacturing a composite article, comprising:
providing a polishing pad including a rough surface;
providing a semiconductor structure disposed above the polishing pad;
contacting the semiconductor structure with the rough surface of the polishing pad;
rotating the semiconductor structure relative to the polishing pad to generate a semiconductor structure debris peeled off from the semiconductor structure and a polishing pad debris peeled off from the polishing pad;
collecting the polishing pad debris generated during the rotation;
providing a wood material; and
mixing the collected polishing pad debris with the wood material to form the composite article.