US 11,911,870 B2
Polishing pads for high temperature processing
Sivapackia Ganapathiappan, Los Altos, CA (US); Rajeev Bajaj, Fremont, CA (US); Yingdong Luo, San Jose, CA (US); Aniruddh Jagdish Khanna, Fremont, CA (US); You Wang, Cupertino, CA (US); and Daniel Redfield, Morgan Hill, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Sep. 10, 2021, as Appl. No. 17/472,006.
Prior Publication US 2023/0080430 A1, Mar. 16, 2023
Int. Cl. B24B 37/24 (2012.01); B24B 37/26 (2012.01); B24B 37/22 (2012.01)
CPC B24B 37/24 (2013.01) [B24B 37/26 (2013.01); B24B 37/22 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A polishing pad, comprising:
a plurality of polishing elements, each comprising:
an individual surface that forms a portion of a polishing surface of the polishing pad; and
one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements, wherein:
each of the polishing elements has a plurality of pore-features formed therein,
each of the polishing elements is formed of a pre-polymer composition, the pre-polymer composition, comprising:
from about 40 wt % to about 50 wt % of a difunctional aliphatic urethane methacrylate, the difunctional aliphatic urethane methacrylate having a chain length within a range of about 2 to about 16 mer units and methacrylate end groups; and
from about 5 wt % to about 10 wt % of a difunctional aliphatic urethane acrylate oligomer having a chain length within a range of about 30 to about 200 mer units and acrylate end groups;
the pre-polymer composition has a glass transition temperature (Tg) of about 80° C. or greater, and
a storage modulus (E′) of the pre-polymer composition at a temperature of 80° C. (E′80) is about 200 MPa or greater.