US 10,219,380 B2
Electronic device module and manufacturing method thereof
Do Jae Yoo, Suwon-Si (KR); Jae Hyun Lim, Suwon-Si (KR); Kyu Hwan Oh, Suwon-Si (KR); and Jong In Ryu, Suwon-Si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do (KR)
Filed on Apr. 1, 2015, as Appl. No. 14/676,745.
Claims priority of application No. 10-2014-0041668 (KR), filed on Apr. 8, 2014.
Prior Publication US 2015/0289392 A1, Oct. 8, 2015
Int. Cl. H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 3/4007 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H05K 1/111 (2013.01); H05K 3/28 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09436 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/2072 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic device module comprising:
a board including external connecting electrodes and mounting electrodes;
an electronic device mounted on the mounting electrodes;
a molded portion sealing the electronic device;
connection conductors each having an end bonded to a respective external connecting electrode and penetrating through the molded portion to an opposite end thereof having an external terminal bonded thereto; and
an insulating layer disposed between the board and the molded portion,
wherein the insulating layer covers the external connecting electrodes, surrounds the connection conductors adjacent to where the connection conductors are bonded to the external connection electrodes, and abuts stepped profile surfaces of the connection conductors.