US 11,895,930 B2
Current sensor package with continuous insulation
Rainer Markus Schaller, Saal a.d. Donau (DE); and Volker Strutz, Tegernheim (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Dec. 20, 2021, as Appl. No. 17/555,809.
Application 17/555,809 is a continuation of application No. 16/441,304, filed on Jun. 14, 2019, granted, now 11,211,551.
Claims priority of application No. 10 2018 114 426.1 (DE), filed on Jun. 15, 2018.
Prior Publication US 2022/0115585 A1, Apr. 14, 2022
Int. Cl. H10N 52/80 (2023.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); G01R 15/20 (2006.01); G01R 19/00 (2006.01); H01L 23/495 (2006.01); H10N 50/01 (2023.01); H10N 50/80 (2023.01); H10N 52/00 (2023.01); H10N 52/01 (2023.01)
CPC H10N 52/80 (2023.02) [G01R 15/202 (2013.01); G01R 15/205 (2013.01); G01R 19/0092 (2013.01); H01L 23/3121 (2013.01); H01L 23/49541 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H10N 50/01 (2023.02); H10N 50/80 (2023.02); H10N 52/00 (2023.02); H10N 52/01 (2023.02); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48247 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of manufacturing a current sensor package, the method comprising:
providing a current path;
providing a sensing device, in particular a sensor chip, the sensing device being configured for sensing a magnetic field generated by a current flowing through the current path and comprising a sensor element;
positioning the sensing device spaced from the current path;
electrically connecting the sensing device to a conductive trace;
providing an encapsulant extending continuously between the current path and the sensing device;
the encapsulant extending continuously between the current path and the conductive trace;
providing a support element for the conductive trace before providing the encapsulant;
removing the support element after providing the encapsulant about the conductive trace and the support element, the removed support element leaving a hole in the encapsulant; and
filling the hole in the encapsulant with an electrically insulating filling material.