CPC H10N 52/80 (2023.02) [G01R 15/202 (2013.01); G01R 15/205 (2013.01); G01R 19/0092 (2013.01); H01L 23/3121 (2013.01); H01L 23/49541 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H10N 50/01 (2023.02); H10N 50/80 (2023.02); H10N 52/00 (2023.02); H10N 52/01 (2023.02); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48247 (2013.01)] | 19 Claims |
1. A method of manufacturing a current sensor package, the method comprising:
providing a current path;
providing a sensing device, in particular a sensor chip, the sensing device being configured for sensing a magnetic field generated by a current flowing through the current path and comprising a sensor element;
positioning the sensing device spaced from the current path;
electrically connecting the sensing device to a conductive trace;
providing an encapsulant extending continuously between the current path and the sensing device;
the encapsulant extending continuously between the current path and the conductive trace;
providing a support element for the conductive trace before providing the encapsulant;
removing the support element after providing the encapsulant about the conductive trace and the support element, the removed support element leaving a hole in the encapsulant; and
filling the hole in the encapsulant with an electrically insulating filling material.
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