US 11,895,817 B2
SRAM device including oxide semiconductor
Sung Haeng Cho, Daejeon (KR); Byung-Do Yang, Daejeon (KR); Sooji Nam, Daejeon (KR); Jaehyun Moon, Daejeon (KR); Jae-Eun Pi, Daejeon (KR); and Jae-Min Kim, Cheongju-si (KR)
Assigned to Electronics and Telecommunications Research Institute, Daejeon (KR)
Filed by Electronics and Telecommunications Research Institute, Daejeon (KR)
Filed on Nov. 18, 2021, as Appl. No. 17/529,817.
Claims priority of application No. 10-2021-0126685 (KR), filed on Sep. 24, 2021.
Prior Publication US 2023/0102625 A1, Mar. 30, 2023
Int. Cl. H10B 10/00 (2023.01); G11C 11/417 (2006.01); G11C 11/412 (2006.01)
CPC H10B 10/12 (2023.02) [G11C 11/412 (2013.01); G11C 11/417 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A static random-access memory (SRAM) device comprising:
a substrate including a PMOS area;
a circuit wiring structure including an insulating layer and a wiring layer alternately stacked on the substrate, wherein the circuit wiring structure comprises a first NMOS area and a second NMOS area vertically separated from the PMOS area with the first NMOS area therebetween;
a first transistor including a first gate electrode disposed on the PMOS area, source/drain areas formed on the PMOS area on both sides of the first gate electrode, and a first channel connecting the source and drain areas to each other;
a second transistor including a second gate electrode disposed in the first NMOS area and a second channel vertically overlapping the second gate electrode; and
a third transistor including a third gate electrode disposed in the second NMOS area and a third channel vertically overlapping the third gate electrode,
wherein the first channel comprises silicon,
wherein the second channel and the third channel comprise an oxide semiconductor.