US 11,895,811 B2
Curved electronic device and method for manufacturing the same
Ping-Hsiang Kao, Miaoli County (TW); Wen-You Lai, Miaoli County (TW); Po-Lun Chen, Miaoli County (TW); Chun-Ta Chen, Miaoli County (TW); Po-Ching Lin, Miaoli County (TW); and Ya-Chu Hsu, Miaoli County (TW)
Assigned to INTERFACE TECHNOLOGY (CHENGDU) CO., LTD., Sichuan (CN); INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., Guangdong (CN); INTERFACE OPTOELECTRONICS (WUXI) CO., LTD., Jiangsu (CN); and GENERAL INTERFACE SOLUTION LIMITED, Miaoli County (TW)
Filed by Interface Technology (ChengDu) Co., Ltd., Sichuan (CN); Interface Optoelectronics (ShenZhen) Co., Ltd., Guangdong (CN); Interface Optoelectronics (Wuxi) Co., Ltd., Jiangsu (CN); and General Interface Solution Limited, Miaoli County (TW)
Filed on Nov. 4, 2021, as Appl. No. 17/519,153.
Claims priority of application No. 202111171989.9 (CN), filed on Oct. 8, 2021.
Prior Publication US 2023/0114927 A1, Apr. 13, 2023
Int. Cl. G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01); G09F 9/30 (2006.01); G06F 3/041 (2006.01)
CPC H05K 7/20963 (2013.01) [G09F 9/301 (2013.01); G06F 3/0412 (2013.01); G06F 3/04164 (2019.05); G06F 2203/04102 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A curved electronic device, comprising:
a substrate;
a component layer, disposed on the substrate, the component layer being composed of a plurality of electronic components and their connecting wiring arranged on the substrate; and
a modulation layer, disposed on the component layer and including at least one pattern area and at least one blank area that are formed on the component layer, wherein the blank area allows one part of the electronic components to be exposed out of the modulation layer, a position of the substrate corresponding to the pattern area and a position of the substrate corresponding to the blank area have different heat absorption rates.