US 11,895,810 B2
Cooling arrangement
Jorma Manninen, Helsinki (FI); Mika Silvennoinen, Helsinki (FI); and Joni Pakarinen, Helsinki (FI)
Assigned to ABB Schweiz AG, Baden (CH)
Filed by ABB Schweiz AG, Baden (CH)
Filed on Jul. 7, 2021, as Appl. No. 17/369,514.
Claims priority of application No. 20184712 (EP), filed on Jul. 8, 2020.
Prior Publication US 2022/0015258 A1, Jan. 13, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/209 (2013.01) 16 Claims
OG exemplary drawing
 
1. A power electronic assembly comprising:
a power electronic module having multiple power electronic components and a cooling element, wherein the cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple vapour chambers arranged to transfer heat generated by the multiple power electronic components, wherein at least one vapour chamber of the multiple vapour chambers is arranged to transfer heat to another vapour chamber of the multiple vapour chambers;
wherein the power electronic module comprises a substrate having an upper surface and a lower surface, wherein the multiple power electronic components are attached to the upper surface, and wherein at least one of the multiple vapour chambers is attached to the lower surface of the substrate.