CPC H05K 7/20154 (2013.01) [F04D 27/004 (2013.01); G06F 1/206 (2013.01); H05K 7/20145 (2013.01); H05K 7/20518 (2013.01)] | 55 Claims |
1. A circuit board, comprising a plurality of heat-generating components, wherein a spacing between adjacent heat-generating components of the plurality of heat-generating components is negatively correlated with a heat dissipation efficiency of a region where the adjacent heat-generating components are located, wherein:
the plurality of heat-generating components comprise at least one row of heat-generating components along a direction of airflow; and
along the direction of airflow, average spacing among first three of the at least one row of heat-generating components is smaller than average spacing among last three of the at least one row of heat-generating components.
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