US 11,895,802 B2
Computational heat dissipation structure, computing device comprising same, mine
Ning Zhang, Beijing (CN); and Nangeng Zhang, Beijing (CN)
Assigned to Canaan Creative Co., LTD., Beijing (CN)
Filed by Canaan Creative Co., LTD., Beijing (CN)
Filed on Jul. 25, 2022, as Appl. No. 17/872,172.
Application 17/872,172 is a continuation of application No. 16/614,054, granted, now 11,425,839, previously published as PCT/CN2018/083956, filed on Apr. 20, 2018.
Claims priority of application No. 201710353744.5 (CN), filed on May 18, 2017.
Prior Publication US 2022/0361363 A1, Nov. 10, 2022
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); F04D 27/00 (2006.01)
CPC H05K 7/20154 (2013.01) [F04D 27/004 (2013.01); G06F 1/206 (2013.01); H05K 7/20145 (2013.01); H05K 7/20518 (2013.01)] 55 Claims
OG exemplary drawing
 
1. A circuit board, comprising a plurality of heat-generating components, wherein a spacing between adjacent heat-generating components of the plurality of heat-generating components is negatively correlated with a heat dissipation efficiency of a region where the adjacent heat-generating components are located, wherein:
the plurality of heat-generating components comprise at least one row of heat-generating components along a direction of airflow; and
along the direction of airflow, average spacing among first three of the at least one row of heat-generating components is smaller than average spacing among last three of the at least one row of heat-generating components.