CPC H05K 3/1216 (2013.01) [C23C 14/021 (2013.01); C23C 14/042 (2013.01); C23C 14/225 (2013.01); C23C 14/34 (2013.01); C23C 16/308 (2013.01)] | 8 Claims |
1. A substrate processing method, the method comprising:
a substrate preparation step of preparing a substrate having an upper surface and a lower surface;
a first pattern formation step of forming a dummy pattern extending in a first direction on the substrate and having a protrusion;
a second pattern formation step of forming a first groove and a second groove each extending in the first direction on the substrate;
a mask arrangement step of arranging a stencil mask having multiple opening patterns on the substrate;
a coating formation step of forming a coating on the substrate through the multiple opening patterns; and
a separation step of separating the dummy pattern from the substrate to divide the substrate into pieces and obtain a divided part of the substrate as a body portion,
wherein:
in the second pattern formation step, the first groove and the second groove each penetrate the substrate in a third direction as a thickness direction of the substrate, and the first groove and the second groove are formed such that a surface to be a side surface of the body portion is exposed,
after the first pattern formation step and before the separation step, the protrusion protrudes from a side surface of the dummy pattern and is formed with a predetermined clearance relative to the surface to be the side surface of the body portion, and
viewed from the third direction, a part of the side surface of the dummy pattern other than the protrusion is positioned a distance away from the surface to be the side surface of the body portion that is greater than the predetermined clearance.
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