US 11,895,771 B2
Printed circuit board
Jin Uk Lee, Suwon-si (KR); Young Ook Cho, Suwon-si (KR); Eun Sun Kim, Suwon-si (KR); and Young Hun You, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 2, 2021, as Appl. No. 17/189,756.
Claims priority of application No. 10-2020-0157764 (KR), filed on Nov. 23, 2020.
Prior Publication US 2022/0167502 A1, May 26, 2022
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/113 (2013.01) [H05K 2201/096 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first insulating layer;
a second insulating layer disposed on the first insulating layer;
a via pad including a first layer embedded in the first insulating layer and a second layer disposed on the first layer and embedded in the second insulating layer, the second layer directly contacting the first layer; and
a first via layer disposed on one side of the via pad, connected to the first layer and penetrating through at least a portion of the first insulating layer, and a second via layer disposed on an opposing side of the via pad, connected to the second layer and penetrating through at least a portion of the second insulating layer,
wherein the second layer has a width decreasing in a direction away from the first layer in a stacking direction of the first and second layers,
each of the first and second layers of the via pad includes a metal material,
the second via layer is in contact with the second layer and has a tapered side surface, and
each of the first and second insulating layers is a single layer.