US 11,895,767 B2
Electronic device filled with phase change material between plurality of circuit boards connected by connecting members
Kyungha Koo, Gyeonggi-do (KR); Hongki Moon, Gyeonggi-do (KR); Chihwan Jeong, Gyeonggi-do (KR); Kuntak Kim, Gyeonggi-do (KR); Yunjeong Park, Gyeonggi-do (KR); Seungjoo Lee, Gyeonggi-do (KR); Haejin Lee, Gyeonggi-do (KR); and Seyoung Jang, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd
Appl. No. 17/286,007
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
PCT Filed Oct. 15, 2019, PCT No. PCT/KR2019/013493
§ 371(c)(1), (2) Date Apr. 16, 2021,
PCT Pub. No. WO2020/085706, PCT Pub. Date Apr. 30, 2020.
Claims priority of application No. 10-2018-0126108 (KR), filed on Oct. 22, 2018.
Prior Publication US 2021/0392736 A1, Dec. 16, 2021
Int. Cl. H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 1/144 (2013.01); H05K 1/18 (2013.01); H05K 2201/047 (2013.01)] 13 Claims
OG exemplary drawing
 
7. An electronic device comprising:
a first circuit board;
a second substrate facing the first substrate;
a connecting member disposed between the first circuit board and the second circuit board to form an internal space, and to electrically connect the first circuit board and the second board;
a phase change material (PCM) filling the internal space and configured to change a state thereof by absorbing thermal energy;
a first resin applied to at least a portion between the first circuit board and the connecting member; and
a second resin applied to at least a portion between the second circuit board and the connecting member,
wherein the first resin and the second resin block the phase change material, which is in a liquid phase, from passing therethrough.