CPC H05K 1/0203 (2013.01) [H05K 1/144 (2013.01); H05K 1/18 (2013.01); H05K 2201/047 (2013.01)] | 13 Claims |
7. An electronic device comprising:
a first circuit board;
a second substrate facing the first substrate;
a connecting member disposed between the first circuit board and the second circuit board to form an internal space, and to electrically connect the first circuit board and the second board;
a phase change material (PCM) filling the internal space and configured to change a state thereof by absorbing thermal energy;
a first resin applied to at least a portion between the first circuit board and the connecting member; and
a second resin applied to at least a portion between the second circuit board and the connecting member,
wherein the first resin and the second resin block the phase change material, which is in a liquid phase, from passing therethrough.
|