CPC H04N 25/79 (2023.01) [H04N 25/704 (2023.01); H04N 25/772 (2023.01); H01L 27/14634 (2013.01)] | 39 Claims |
1. An event detection sensor comprising:
a first chip including:
a photoelectric conversion region; and
a first portion of current-voltage conversion circuit, wherein the current-voltage conversion circuit is coupled to the photoelectric conversion region, and
a second chip including:
a second portion of the current-voltage conversion circuit;
a buffer coupled to the current-voltage conversion circuit; and
a quantizer coupled to the buffer via a capacitor, wherein the quantizer outputs an event detection signal,
wherein, the first chip and the second chip are electrically connected by a metal bonding.
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