US 11,895,379 B2
Electronic device
Jungsik Park, Gyeonggi-do (KR); Taewoo Kim, Gyeonggi-do (KR); Sangyoup Seok, Gyeonggi-do (KR); Kwonho Son, Gyeonggi-do (KR); Sunghyup Lee, Gyeonggi-do (KR); and Heeseok Jung, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Dec. 9, 2021, as Appl. No. 17/546,697.
Application 17/546,697 is a continuation of application No. PCT/KR2021/018024, filed on Dec. 1, 2021.
Claims priority of application No. 10-2020-0176695 (KR), filed on Dec. 16, 2020.
Prior Publication US 2022/0191352 A1, Jun. 16, 2022
Int. Cl. H04N 23/51 (2023.01); H04M 1/02 (2006.01)
CPC H04N 23/51 (2023.01) [H04M 1/0264 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing including a first plate facing a first direction, a second plate facing a second direction that is opposite to the first direction, and a side member surrounding a space between the first plate and the second plate;
a camera deco disposed on at least one of the first plate and the second plate;
a flash disposed proximate to the camera deco;
a first circuit board disposed to overlap at least a portion of the flash when viewed in the first direction;
a second circuit board spaced apart from the first circuit board;
a first sealing member disposed between the second plate and the flash;
a second sealing member disposed between the flash and at least one of the first circuit board and the second circuit board;
a first component and a second component disposed on at least a portion of the first circuit board or at least a portion of the second circuit board; and
an interposer electrically connecting the first circuit board and the second circuit board,
wherein a passage for transferring a sound is disposed between a flash hole formed in the second plate and a through hole formed in the flash, and
wherein the interposer is disposed between the first circuit board and the second circuit board and forms an arrangement space for disposing the first component and the second component between the first circuit board and the second circuit board.