CPC H03H 3/08 (2013.01) [B23K 26/362 (2013.01); H03H 9/02559 (2013.01); H03H 9/02622 (2013.01); H03H 9/059 (2013.01); H03H 9/1064 (2013.01); H03H 9/1092 (2013.01); H03H 9/25 (2013.01); G01N 2291/0423 (2013.01); H01L 2224/16 (2013.01)] | 20 Claims |
1. A packaged surface acoustic wave device comprising:
a laser-marked piezoelectric substrate having a first side and a second side, the second side of the laser-marked piezoelectric substrate having a laser-marked section, the laser-marked section having an alphanumeric marking; and
an interdigital transducer electrode encapsulated within a package structure and supported by the first side of the laser-marked piezoelectric substrate, the package structure defining a cavity enclosing the interdigital transducer electrode.
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