US 11,894,824 B2
Laser-marked packaged surface acoustic wave devices
Li Ann Koo, Singapore (SG); Takashi Inoue, Singapore (SG); Vivian Sing Zhi Lee, Singapore (SG); and Ping Yi Tan, Muar (MY)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Aug. 29, 2019, as Appl. No. 16/555,860.
Claims priority of provisional application 62/725,133, filed on Aug. 30, 2018.
Prior Publication US 2020/0076398 A1, Mar. 5, 2020
Int. Cl. H03H 9/02 (2006.01); H03H 3/08 (2006.01); B23K 26/362 (2014.01); H03H 9/10 (2006.01); H03H 9/25 (2006.01); H03H 9/05 (2006.01)
CPC H03H 3/08 (2013.01) [B23K 26/362 (2013.01); H03H 9/02559 (2013.01); H03H 9/02622 (2013.01); H03H 9/059 (2013.01); H03H 9/1064 (2013.01); H03H 9/1092 (2013.01); H03H 9/25 (2013.01); G01N 2291/0423 (2013.01); H01L 2224/16 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A packaged surface acoustic wave device comprising:
a laser-marked piezoelectric substrate having a first side and a second side, the second side of the laser-marked piezoelectric substrate having a laser-marked section, the laser-marked section having an alphanumeric marking; and
an interdigital transducer electrode encapsulated within a package structure and supported by the first side of the laser-marked piezoelectric substrate, the package structure defining a cavity enclosing the interdigital transducer electrode.