CPC H01S 5/0683 (2013.01) [H01S 5/0264 (2013.01); H01S 5/0287 (2013.01); H01S 5/02257 (2021.01); H01S 5/02325 (2021.01); H01S 5/18305 (2013.01); H01S 5/423 (2013.01); H01S 5/005 (2013.01); H01S 5/0217 (2013.01); H01S 5/02212 (2013.01); H01S 5/02345 (2021.01); H01S 5/183 (2013.01); H01S 5/18361 (2013.01); H01S 5/34 (2013.01)] | 19 Claims |
1. A VCSEL device comprising:
a VCSEL chip, the VCSEL chip having a center point and a top surface, and
a photodiode, the photodiode having a center point, wherein the VCSEL chip and the photodiode arranged on a submount such that the center point of the VCSEL chip is separated from the center point of the photodiode by a first distance;
wherein the VCSEL chip and photodiode are housed in a package, the package having:
a window configured and arranged to allow light emitted from the VCSEL chip to pass through the window;
a spacer arranged between the submount and the window; and
a diffuser arranged on the window and completely covering a surface of the window, the diffuser being arranged at a height of a second distance above the top surface of the VCSEL chip, wherein the second distance is less than the first distance;
wherein light emitted by the VCSEL chip travels in three manners:
a portion of the light is transmitted through the diffuser and through the window;
a portion of the light is repeatedly scattered and reflected along the window for a lateral distance; and
a portion of the light is scattered by the diffuser back into the package and to the photodiode.
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