CPC H01S 3/0405 (2013.01) [H01S 3/025 (2013.01); H01S 3/061 (2013.01); H01S 3/0615 (2013.01); H01S 3/0623 (2013.01); H01S 3/06754 (2013.01); H01S 3/1643 (2013.01); H01S 5/0216 (2013.01); H01S 5/50 (2013.01); H05K 5/06 (2013.01)] | 20 Claims |
1. A method, comprising:
assembling an amplifier assembly that includes a first heat sink plate, a second heat sink plate, at least one solder preform, and an amplifier rod,
wherein the at least one solder preform comprises a non-eutectic solder,
wherein the amplifier rod is disposed in a first channel of the at least one solder preform and a second channel of the at least one solder preform,
wherein the first channel of the at least one solder preform is received in a first channel of the first heat sink plate, and the second channel of the at least one solder preform is received in a second channel of the second heat sink plate; and
compressing the amplifier assembly while heating the amplifier assembly at a temperature that causes a reflow of the at least one solder preform.
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