US 11,894,651 B2
Amplifier assembly
Christoffer Stroemberg, Schlieren (CH); Susan Fung, San Jose, CA (US); and Derek A. Tucker, San Jose, CA (US)
Assigned to Lumentum Operations LLC, San Jose, CA (US)
Filed by Lumentum Operations LLC, San Jose, CA (US)
Filed on May 16, 2022, as Appl. No. 17/663,479.
Application 17/663,479 is a division of application No. 16/588,708, filed on Sep. 30, 2019, granted, now 11,349,274.
Claims priority of provisional application 62/746,337, filed on Oct. 16, 2018.
Prior Publication US 2022/0278496 A1, Sep. 1, 2022
Int. Cl. H01S 3/04 (2006.01); H05K 5/06 (2006.01); H01S 3/16 (2006.01); H01S 3/06 (2006.01); H01S 3/067 (2006.01); H01S 5/02 (2006.01); H01S 3/02 (2006.01); H01S 5/50 (2006.01)
CPC H01S 3/0405 (2013.01) [H01S 3/025 (2013.01); H01S 3/061 (2013.01); H01S 3/0615 (2013.01); H01S 3/0623 (2013.01); H01S 3/06754 (2013.01); H01S 3/1643 (2013.01); H01S 5/0216 (2013.01); H01S 5/50 (2013.01); H05K 5/06 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
assembling an amplifier assembly that includes a first heat sink plate, a second heat sink plate, at least one solder preform, and an amplifier rod,
wherein the at least one solder preform comprises a non-eutectic solder,
wherein the amplifier rod is disposed in a first channel of the at least one solder preform and a second channel of the at least one solder preform,
wherein the first channel of the at least one solder preform is received in a first channel of the first heat sink plate, and the second channel of the at least one solder preform is received in a second channel of the second heat sink plate; and
compressing the amplifier assembly while heating the amplifier assembly at a temperature that causes a reflow of the at least one solder preform.