US 11,894,597 B2
Directional coupler and electronic component module
Daisuke Tokuda, Kyoto (JP); and Yasushi Shigeno, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Sep. 22, 2020, as Appl. No. 17/028,320.
Claims priority of application No. 2019-176322 (JP), filed on Sep. 27, 2019.
Prior Publication US 2021/0098854 A1, Apr. 1, 2021
Int. Cl. H01P 5/18 (2006.01); H05K 1/02 (2006.01); H01P 3/08 (2006.01)
CPC H01P 5/18 (2013.01) [H01P 3/08 (2013.01); H05K 1/0243 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A directional coupler comprising:
a substrate having a first principal surface and a second principal surface opposing each other;
a first main line and a second main line each including a conductor pattern provided in or on the substrate, and connected in parallel to each other; and
a first sub-line including a conductor pattern provided in or on the substrate,
wherein the first sub-line is disposed at a position at least partially overlapping with the first main line in a plan view when seen in a thickness direction orthogonal to the first principal surface and the second principal surface,
the first principal surface is a connection surface to another substrate to which a high frequency signal detected by the directional coupler is transmitted, and
the first main line is disposed closer to a side of the first principal surface than the first sub-line.