CPC H01P 5/18 (2013.01) [H01P 3/08 (2013.01); H05K 1/0243 (2013.01)] | 17 Claims |
1. A directional coupler comprising:
a substrate having a first principal surface and a second principal surface opposing each other;
a first main line and a second main line each including a conductor pattern provided in or on the substrate, and connected in parallel to each other; and
a first sub-line including a conductor pattern provided in or on the substrate,
wherein the first sub-line is disposed at a position at least partially overlapping with the first main line in a plan view when seen in a thickness direction orthogonal to the first principal surface and the second principal surface,
the first principal surface is a connection surface to another substrate to which a high frequency signal detected by the directional coupler is transmitted, and
the first main line is disposed closer to a side of the first principal surface than the first sub-line.
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