US 11,894,505 B2
Display device and manufacturing method thereof
Junling Liu, Shenzhen (CN)
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/057,091
Filed by SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Shenzhen (CN)
PCT Filed Oct. 21, 2020, PCT No. PCT/CN2020/122453
§ 371(c)(1), (2) Date Nov. 19, 2020,
PCT Pub. No. WO2022/047913, PCT Pub. Date Mar. 10, 2022.
Claims priority of application No. 202010907316.4 (CN), filed on Sep. 2, 2020.
Prior Publication US 2022/0310873 A1, Sep. 29, 2022
Int. Cl. H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/10 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/005 (2013.01); H01L 33/10 (2013.01); H01L 2933/0066 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A display device, comprising:
a substrate;
a conductive layer disposed on the substrate, the conductive layer comprising a plurality of sub-conductive layers stacked in sequence; and
a reflective layer disposed on the conductive layer;
wherein a plurality of flask-shaped holes are disposed in the reflective layer and part of the conductive layer,
each of the flask-shaped holes comprises an arc-shaped bottom portion and a cylindrical portion connected to the arc-shaped bottom portion, the arc-shaped bottom portion is disposed in the conductive layer, and the cylindrical portion penetrates the reflective layer, and
a depth of the arc-shaped bottom portion is greater than half of a thickness of an uppermost one of the sub-conductive layers and less than a thickness of the conductive layer.