CPC H01L 33/58 (2013.01) [H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 33/56 (2013.01)] | 24 Claims |
1. A light-emitting diode (LED) package comprising:
a submount;
at least one LED chip on the submount;
at least one spacer on the submount; and
a lens on the at least one spacer such that the at least one spacer is between the lens and the at least one LED chip and a cavity is at least partially formed between the lens and the submount, the cavity being registered with the at least one LED chip and configured to allow air flow between an interior volume of the cavity and an ambient environment outside the LED package during operation of the at least one LED chip.
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