CPC H01L 33/486 (2013.01) [H01L 33/10 (2013.01); H01L 33/46 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01)] | 19 Claims |
1. A micro LED structure, comprising:
a first micro LED chip having opposite first and second sides;
a second micro LED chip adjacent to the first side of the first micro LED chip;
a third micro LED chip adjacent to the first side of the first micro LED chip, wherein each of the first micro LED chip, the second micro LED chip and the third micro LED chip comprises:
a semiconductor stack comprising a first semiconductor layer, an active layer in contact with the first semiconductor layer, and a second semiconductor layer in contact with the active layer;
a metal pad in contact with the first semiconductor layer; and
a reflective coating layer disposed around sidewalls of the semiconductor stack;
optical structures respectively over the first micro LED chip, the second micro LED chip and the third micro LED chip; and
a planarization layer surrounding the first micro LED, the second micro LED and the third micro LED.
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