US 11,894,492 B2
Light emitting element and reflective-type encoder
Shota Someya, Hamamatsu (JP); Takayuki Hoshino, Hamamatsu (JP); and Shunji Suzuki, Hamamatsu (JP)
Assigned to HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Filed by HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Filed on Dec. 28, 2022, as Appl. No. 18/090,002.
Claims priority of application No. 2022-000133 (JP), filed on Jan. 4, 2022.
Prior Publication US 2023/0215989 A1, Jul. 6, 2023
Int. Cl. H01L 33/46 (2010.01); G01D 5/347 (2006.01); H01L 25/16 (2023.01); H01L 33/20 (2010.01)
CPC H01L 33/46 (2013.01) [G01D 5/3473 (2013.01); H01L 25/167 (2013.01); H01L 33/20 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A light emitting element comprising:
a substrate;
a mesa portion formed on the substrate and including an active layer that generates light, a first semiconductor layer disposed on a side of the substrate with respect to the active layer, and a second semiconductor layer disposed on a side opposite to the substrate with respect to the active layer;
a metal layer including a first part disposed on a top surface of the mesa portion and electrically connected to the second semiconductor layer and a second part formed integrally with the first part and extending along a side surface of the mesa portion;
an insulating layer formed at least on the side surface of the mesa portion; and
a resin layer formed on the insulating layer, wherein
the first part includes a region formed with a light passage opening through which the light passes and a region for external connection, and
the second part is formed on the side surface of the mesa portion via the insulating layer and the resin layer and overlaps at least the active layer when viewed in a direction perpendicular to a thickness direction of the substrate.