US 11,894,490 B2
Spherical flip-chip micro-LED, method for manufacturing the same, and display panel
Biao Tang, Chongqing (CN); Haiping Liu, Chongqing (CN); and Zhongshan Feng, Chongqing (CN)
Assigned to CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD, Chongqing (CN)
Filed by CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD., Chongqing (CN)
Filed on Jun. 29, 2021, as Appl. No. 17/362,256.
Application 17/362,256 is a continuation of application No. PCT/CN2020/091841, filed on May 22, 2020.
Prior Publication US 2021/0376195 A1, Dec. 2, 2021
Int. Cl. H01L 33/38 (2010.01); H01L 33/40 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01)
CPC H01L 33/382 (2013.01) [H01L 25/0753 (2013.01); H01L 33/005 (2013.01); H01L 33/40 (2013.01); H01L 33/62 (2013.01); H01L 2933/0016 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A spherical flip-chip micro-LED, comprising:
a light-emitting body;
a supporting body being transparent;
a first electrode and a second electrode which are electrically coupled with the light-emitting body; and
an insulating protective layer covering the light-emitting body, wherein the light-emitting body, the supporting body, and the insulating protective layer form a spherical structure.