US 11,894,485 B2
Solar cell wafer wire bonding method
Vergil R. Sandoval, Calamba (PH); Emmanuel C. Abas, Laguna (PH); and Yafu Lin, San Jose, CA (US)
Assigned to Maxeon Solar Pte. Ltd, Singapore (SG)
Filed by Maxeon Solar Pte. Ltd, Singapore (SG)
Filed on Sep. 28, 2021, as Appl. No. 17/487,623.
Claims priority of provisional application 63/124,970, filed on Dec. 14, 2020.
Prior Publication US 2022/0190190 A1, Jun. 16, 2022
Int. Cl. H01L 31/18 (2006.01); H01B 13/00 (2006.01); H01L 31/05 (2014.01)
CPC H01L 31/188 (2013.01) [H01B 13/0003 (2013.01); H01L 31/05 (2013.01); Y10T 29/49117 (2015.01)] 7 Claims
OG exemplary drawing
 
1. A method of attaching wires to a solar cell wafer, the method comprising:
soldering a first portion of each of a first plurality of wires on a solar cell wafer;
in a first instance, moving the solar cell wafer to draw the first plurality of wires across the solar cell wafer;
after moving the solar cell wafer in the first instance, soldering a second portion of each of the first plurality of wires on the solar cell wafer;
cutting each of the first plurality of wires; and
in a second instance, moving the solar cell wafer to create a gap between the first plurality of wires and a second plurality of wires on the solar cell wafer.