US 11,894,473 B2
Sensing module and manufacturing method thereof
Ruei Chi Chen, Hsinchu (TW); and Chih Lin Yang, New Taipei (TW)
Assigned to Chu Hua Chang, Zhubei (TW)
Filed by CHIP POSITION SYSTEM CO., LTD., Hsinchu County (TW)
Filed on Sep. 9, 2021, as Appl. No. 17/363,305.
Prior Publication US 2023/0076715 A1, Mar. 9, 2023
Int. Cl. H01L 31/0232 (2014.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01)
CPC H01L 31/02322 (2013.01) [B81B 7/0077 (2013.01); B81C 1/00269 (2013.01); H01L 31/02325 (2013.01); B81B 2201/0285 (2013.01); B81B 2201/0292 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/032 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing a sensing module, comprising:
providing a substrate;
disposing or forming a sensor on a first surface of the substrate;
disposing at least one colloid on the first surface to surround the sensor;
disposing an optical conversion element on the substrate and bonding at least one colloid with a lower edge of the optical conversion element, forming a hermetic chamber between the optical conversion element and the substrate; and
using a light source to irradiate a second surface of the substrate, making a plurality of light rays of the light source penetrates the substrate to irradiate and solidify the at least one colloid;
wherein a material of the substrate is selected from a group of acrylic, glass, sapphire, and silicon; the material of optical conversion element is selected from a group of silicon, germanium and zinc sulfide.