US 11,894,472 B2
Leave-in etch mask for foil-based metallization of solar cells
Richard Hamilton Sewell, Los Altos, CA (US); David Fredric Joel Kavulak, Fremont, CA (US); Taeseok Kim, Pleasanton, CA (US); and Gabriel Harley, Mountain View, CA (US)
Assigned to Maxeon Solar Pte. Ltd., Singapore (SG)
Filed by Maxeon Solar Pte. Ltd., Singapore (SG)
Filed on Oct. 28, 2020, as Appl. No. 17/082,995.
Application 17/082,995 is a continuation of application No. 14/752,828, filed on Jun. 26, 2015, abandoned.
Prior Publication US 2021/0057593 A1, Feb. 25, 2021
Int. Cl. H01L 31/0224 (2006.01); H01L 31/068 (2012.01); H01L 31/18 (2006.01)
CPC H01L 31/022441 (2013.01) [H01L 31/0682 (2013.01); H01L 31/1804 (2013.01); Y02E 10/547 (2013.01); Y02P 70/50 (2015.11)] 20 Claims
OG exemplary drawing
 
1. A solar cell, comprising:
a substrate having a back surface and an opposing light-receiving surface;
a plurality of N-type and P-type semiconductor regions disposed in or above the back surface of the substrate;
a conductive contact structure disposed on the plurality of N-type and P-type semiconductor regions, the conductive contact structure comprising metal foil portions in alignment with corresponding ones of the N-type and P-type semiconductor regions, wherein one or more of the metal foil portions extends laterally beyond the substrate; and
a patterned epoxy material layer disposed on the conductive contact structure, the patterned epoxy material layer disposed on and in alignment with the metal foil portions, and the patterned epoxy material layer coating a top, a bottom and ends of each of the one or more of the metal foil portions that extends laterally beyond the substrate.