US 11,894,405 B2
Image sensor package
Kyongsoon Cho, Incheon (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 26, 2021, as Appl. No. 17/331,092.
Claims priority of application No. 10-2020-0146318 (KR), filed on Nov. 4, 2020.
Prior Publication US 2022/0139984 A1, May 5, 2022
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14623 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14685 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An image sensor package comprising:
a package substrate;
an image sensor chip on the package substrate;
a dam structure on the image sensor chip and comprising a dam main body having an opening and a first light absorption layer on an inner wall of the dam main body;
a transparent substrate on the dam structure; and
an encapsulant contacting the image sensor chip and an outer wall of the dam main body,
wherein the dam structure further comprises a second light absorption layer on an upper surface of the dam main body, and
wherein the second light absorption layer vertically overlaps the whole dam main body.