US 11,894,394 B2
Array substrate, method for preparing array substrate, and backlight module
Zhanfeng Cao, Beijing (CN); Yingwei Liu, Beijing (CN); Ke Wang, Beijing (CN); Guocai Zhang, Beijing (CN); Jianguo Wang, Beijing (CN); Zhiwei Liang, Beijing (CN); Haixu Li, Beijing (CN); and Muxin Di, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/281,015
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Jan. 3, 2020, PCT No. PCT/CN2020/070325
§ 371(c)(1), (2) Date Mar. 29, 2021,
PCT Pub. No. WO2021/134794, PCT Pub. Date Jul. 8, 2021.
Prior Publication US 2022/0123024 A1, Apr. 21, 2022
Int. Cl. H01L 27/12 (2006.01); H01L 27/15 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01)
CPC H01L 27/124 (2013.01) [C25D 7/123 (2013.01); C25D 17/007 (2013.01); H01L 27/127 (2013.01); H01L 27/156 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for preparing an array substrate, comprising:
forming a pattern of a seed layer in a wiring region of a base substrate;
forming a pattern of a lead electrode at a first side of the wiring region, the lead electrode being electrically connected with the seed layer;
forming a pattern of a blocking dam on a side, where the pattern of the seed layer is formed, of the base substrate, the pattern of the seed layer being complementary with the pattern of the blocking dam; and
electroplating a pattern of a first metal layer on the pattern of the seed layer, and when electroplating the pattern of the first metal layer, connecting the lead electrode with a negative pole of a power supply;
wherein before said electroplating the pattern of the first metal layer on the pattern of the seed layer, the method further comprises:
forming a pattern of a compensation electrode wire electrically connected with the lead electrode on a side, where the lead electrode is formed, of the base substrate;
wherein the compensation electrode wire is at least at a second side of the wiring region, and the first side and the second side are different sides of the wiring region.