US 11,894,366 B2
Trench capacitor assembly for high capacitance density
Jonghae Kim, San Diego, CA (US); Milind Shah, San Diego, CA (US); and Periannan Chidambaram, San Diego, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Apr. 10, 2023, as Appl. No. 18/298,211.
Application 18/298,211 is a division of application No. 17/144,411, filed on Jan. 8, 2021, granted, now 11,652,101.
Prior Publication US 2023/0246024 A1, Aug. 3, 2023
Int. Cl. H01L 27/08 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01L 49/02 (2006.01); H01L 29/94 (2006.01); H01L 29/66 (2006.01); H10B 12/00 (2023.01)
CPC H01L 27/0805 (2013.01) [H01L 23/642 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 28/40 (2013.01); H01L 28/90 (2013.01); H01L 29/66181 (2013.01); H01L 29/945 (2013.01); H10B 12/038 (2023.02); H10B 12/37 (2023.02); H10B 12/39 (2023.02); H01L 2924/19041 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A stacked capacitor assembly comprising a plurality of capacitor assemblies stacked vertically and electrically coupled together, wherein at least one of the plurality of capacitor assemblies comprises a first capacitor assembly, the first capacitor assembly comprising:
a first array of trench capacitors; and
a second array of trench capacitors disposed adjacent to and electrically coupled to the first array of trench capacitors, the second array of trench capacitors being inverted with respect to the first array of trench capacitors.