CPC H01L 25/18 (2013.01) [H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08145 (2013.01)] | 19 Claims |
1. A chip, comprising:
a substrate; and
a plurality of functional units on the substrate, wherein each of the functional units has its own set of pads, the set of pads of each of the functional units comprise I/O pads, power pads, and ground pads, wherein each of the functional units is configured to be individually controlled.
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