US 11,894,356 B2
Chip having multiple functional units and semiconductor structure using the same
Shih-Hung Chen, Hsinchu County (TW)
Assigned to MACRONIX INTERNATIONAL CO., LTD., Hsinchu (TW)
Filed by MACRONIX INTERNATIONAL CO., LTD., Hsinchu (TW)
Filed on Aug. 17, 2021, as Appl. No. 17/403,925.
Prior Publication US 2023/0054100 A1, Feb. 23, 2023
Int. Cl. H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08145 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A chip, comprising:
a substrate; and
a plurality of functional units on the substrate, wherein each of the functional units has its own set of pads, the set of pads of each of the functional units comprise I/O pads, power pads, and ground pads, wherein each of the functional units is configured to be individually controlled.