US 11,894,352 B2
Power electronic module with enhanced thermal and electrical performance
Sri Ganesh A Tharumalingam, Fremont, CA (US); Mark Kwoka, Palm Bay, FL (US); Viresh Piyush Patel, Austin, TX (US); Peter Zhizheng Liu, Fremont, CA (US); and Jeff Strang, Durham, NC (US)
Assigned to Renesas Electronics America Inc., Milpitas, CA (US)
Filed by Renesas Electronics America Inc., Milpitas, CA (US)
Filed on May 18, 2021, as Appl. No. 17/323,166.
Prior Publication US 2022/0375909 A1, Nov. 24, 2022
Int. Cl. H01L 25/16 (2023.01); H01L 23/367 (2006.01); H05K 7/02 (2006.01)
CPC H01L 25/162 (2013.01) [H01L 23/3675 (2013.01); H05K 7/02 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A power electronic module comprising: a first substrate having a first surface and a second surface opposite the first surface; a second substrate spaced apart from the first substrate and having a third surface and a fourth surface that is opposite the third surface, wherein the third surface of the second substrate faces the second surface of the first substrate; a first electronic component located between the second surface of the first substrate and the third surface of the second substrate, the first electronic component having a first terminal and a second terminal; wherein the first electronic component comprises an inductor; a second electronic component spaced apart from the first electronic component and located on the second substrate, wherein the second electronic component comprises at least one capacitor; a connector structure laterally surrounding the first electronic component and connecting the first substrate and the second substrate; and a semiconductor component located on the fourth surface of the second substrate, wherein the semiconductor component is electrically connected with the first substrate via the first terminal and the second terminal, and the first terminal of the first electronic component electrically contacts the first substrate, and the second terminal of the first electronic component electrically contacts the second substrate.