US 11,894,350 B2
Fluidic assembly enabled mass transfer for microLED displays
Paul J. Schuele, Washougal, WA (US); Kenji Sasaki, West Linn, OR (US); Kurt Ulmer, Vancouver, WA (US); and Jong-Jan Lee, Camas, WA (US)
Assigned to e Lux, Inc., Vancouver, WA (US)
Filed by eLux Inc., Vancouver, WA (US)
Filed on Nov. 23, 2020, as Appl. No. 17/101,016.
Application 17/101,016 is a continuation in part of application No. 16/875,994, filed on May 16, 2020, granted, now 11,296,059.
Application 16/875,994 is a continuation in part of application No. 16/846,493, filed on Apr. 13, 2020, granted, now 11,251,166.
Application 16/846,493 is a continuation in part of application No. 16/727,186, filed on Dec. 26, 2019, granted, now 11,145,787.
Application 16/727,186 is a continuation of application No. 16/406,196, filed on May 8, 2019, granted, now 10,643,981.
Application 16/406,196 is a continuation in part of application No. 16/406,080, filed on May 8, 2019, granted, now 10,804,426.
Application 16/406,080 is a continuation in part of application No. 16/125,671, filed on Sep. 8, 2018, granted, now 10,516,084, issued on Dec. 24, 2019.
Application 16/125,671 is a continuation in part of application No. 15/838,536, filed on Dec. 12, 2017, granted, now 10,242,977, issued on Mar. 26, 2019.
Application 15/838,536 is a continuation in part of application No. 15/722,037, filed on Oct. 2, 2017, granted, now 10,543,486, issued on Jan. 28, 2020.
Application 15/722,037 is a continuation in part of application No. 15/691,976, filed on Aug. 31, 2017, granted, now 10,535,640, issued on Jan. 14, 2020.
Application 15/691,976 is a continuation in part of application No. 15/440,735, filed on Feb. 23, 2017, granted, now 10,381,335, issued on Aug. 13, 2019.
Application 15/440,735 is a continuation in part of application No. 15/416,882, filed on Jan. 26, 2017, granted, now 10,446,728, issued on Nov. 15, 2019.
Application 15/413,053 is a continuation in part of application No. 15/412,731, filed on Jan. 23, 2017, granted, now 10,418,527, issued on Sep. 17, 2019.
Application 15/416,882 is a continuation in part of application No. 15/413,053, filed on Jan. 23, 2017, granted, now 10,520,769, issued on Dec. 31, 2019.
Application 15/412,731 is a continuation in part of application No. 15/410,195, filed on Jan. 19, 2017, granted, now 10,236,279, issued on Mar. 19, 2019.
Application 15/410,195 is a continuation in part of application No. 15/410,001, filed on Jan. 19, 2017, granted, now 9,825,202, issued on Nov. 21, 2017.
Application 15/410,001 is a continuation in part of application No. 15/266,796, filed on Sep. 15, 2016, granted, now 9,917,226, issued on Mar. 13, 2018.
Application 15/266,796 is a continuation in part of application No. 15/221,571, filed on Jul. 27, 2016, granted, now 9,755,110, issued on Sep. 5, 2017.
Application 15/221,571 is a continuation in part of application No. 15/197,266, filed on Jun. 29, 2016, granted, now 10,249,599, issued on Apr. 2, 2019.
Application 15/410,001 is a continuation in part of application No. 15/190,813, filed on Jun. 23, 2016, granted, now 9,892,944, issued on Feb. 13, 2018.
Application 15/190,813 is a continuation in part of application No. 15/158,556, filed on May 18, 2016, granted, now 9,985,190, issued on May 29, 2018.
Application 15/158,556 is a continuation in part of application No. 14/749,569, filed on Jun. 24, 2015, granted, now 9,722,145, issued on Aug. 1, 2017.
Application 15/266,796 is a continuation in part of application No. 14/680,618, filed on Apr. 7, 2015, granted, now 10,115,862, issued on Oct. 30, 2018.
Application 14/680,618 is a continuation in part of application No. 14/530,230, filed on Oct. 31, 2014, abandoned.
Prior Publication US 2021/0091052 A1, Mar. 25, 2021
Int. Cl. H01L 25/075 (2006.01); H01L 33/48 (2010.01); H01L 33/38 (2010.01); H01L 21/673 (2006.01); H01L 21/70 (2006.01)
CPC H01L 25/0753 (2013.01) [H01L 21/67316 (2013.01); H01L 21/67343 (2013.01); H01L 21/70 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A micro-light emitting diode (microLED) mass transfer stamping system comprising:
a stamp substrate with a top surface;
an array of stamp substrate trap sites formed on the top surface, each trap site configured as a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED; and
wherein the microLEDs are surface mount microLEDs, each having a planar top surface with a first electrode and a second electrode, and wherein the keel is electrically nonconductive.