CPC H01L 25/071 (2013.01) [H01L 23/367 (2013.01); H01L 24/32 (2013.01); H01L 25/50 (2013.01); H01L 2224/32245 (2013.01)] | 20 Claims |
1. A semiconductor package comprising:
a first substrate;
a second substrate;
a spacer coupled between the first substrate and the second substrate;
a lead frame between the first substrate and the second substrate; and
a molding compound at least partially encapsulating the lead frame;
wherein a perimeter of the first substrate only partially overlaps a perimeter of the second substrate and the perimeter of the second substrate only partially overlaps the perimeter of the first substrate when the first substrate and second substrate are coupled through the spacer.
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