CPC H01L 25/0657 (2013.01) [H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01)] | 19 Claims |
1. An apparatus, comprising:
an integrated circuit (IC) die stack comprising at least a first die under a second die; and
a film between the first die and the second die, wherein the film comprises an electrically conductive layer over a first surface of the first die and an electrically insulative layer over a second surface of the second die.
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