US 11,894,339 B2
Proximity sensor
Sreenivasan Kalyani Koduri, Allen, TX (US); and Leslie Edward Stark, Rockwall, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Dec. 14, 2020, as Appl. No. 17/121,198.
Prior Publication US 2022/0189912 A1, Jun. 16, 2022
Int. Cl. H01L 25/04 (2023.01); H01L 25/075 (2006.01); G01S 17/08 (2006.01); H01L 33/62 (2010.01)
CPC H01L 25/042 (2013.01) [G01S 17/08 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method, comprising: forming a first structure on a first circuit; forming a second structure on a second circuit; encapsulating the first and second circuits and at least a part of the first and second structures with a molding compound; removing the first structure from the molding compound to form a first cavity over the first circuit; removing the second structure from the molding compound to form a second cavity over the second circuit; and forming a second material different from the molding compound in at least part of one of the first and second cavities.