CPC H01L 25/042 (2013.01) [G01S 17/08 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01)] | 14 Claims |
1. A method, comprising: forming a first structure on a first circuit; forming a second structure on a second circuit; encapsulating the first and second circuits and at least a part of the first and second structures with a molding compound; removing the first structure from the molding compound to form a first cavity over the first circuit; removing the second structure from the molding compound to form a second cavity over the second circuit; and forming a second material different from the molding compound in at least part of one of the first and second cavities.
|