CPC H01L 24/94 (2013.01) [H01L 23/3121 (2013.01); H01L 24/14 (2013.01); H01L 25/0657 (2013.01)] | 18 Claims |
1. A package comprising:
a semiconductor chip on a package substrate, the package substrate including a trench having a line shape, the trench extending in a first direction along a first side surface of the semiconductor chip on the package substrate; and
an underfill filling a space between the package substrate and the semiconductor chip, the underfill filling the trench,
wherein the trench is disposed on a portion of the package substrate to overlap with at least a portion of the semiconductor chip in a second direction perpendicular to the first direction.
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