US 11,894,336 B2
Integrated fan-out package and manufacturing method thereof
Jhih-Yu Wang, New Taipei (TW); Hung-Jui Kuo, Hsinchu (TW); Yu-Hsiang Hu, Hsinchu (TW); Sih-Hao Liao, New Taipei (TW); and Yung-Chi Chu, Kaohsiung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Sep. 3, 2021, as Appl. No. 17/465,872.
Application 17/465,872 is a continuation of application No. 16/009,211, filed on Jun. 15, 2018, granted, now 11,114,407.
Prior Publication US 2021/0398942 A1, Dec. 23, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/82 (2013.01) [H01L 23/544 (2013.01); H01L 24/02 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 25/0655 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24155 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/82132 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated fan-out (InFO) package, comprising:
a die;
a plurality of conductive structures aside the die;
an encapsulant laterally encapsulating the die and the plurality of conductive structures; and
a redistribution structure disposed on the encapsulant, wherein the redistribution structure comprises a plurality of routing patterns, a plurality of conductive vias, and a plurality of alignment marks, the plurality of routing patterns and the plurality of conductive vias are electrically connected to the die and the plurality of conductive structures, the plurality of alignment marks surrounds the plurality of routing patterns and the plurality of conductive vias, the plurality of alignment marks is electrically insulated from the die and the plurality of conductive structures, at least one of the plurality of alignment marks is in physical contact with the encapsulant, and vertical projections of the plurality of alignment marks onto the encapsulant have an offset from one another.