US 11,894,334 B2
Dual head capillary design for vertical wire bond
Yuhong Cai, Folsom, CA (US); Bilal Khalaf, Folsom, CA (US); and Yi Xu, Folsom, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 15, 2018, as Appl. No. 16/160,212.
Prior Publication US 2020/0118961 A1, Apr. 16, 2020
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/48 (2013.01) [H01L 24/78 (2013.01); H01L 25/0657 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wire bond, comprising:
a first attachment ball attached to a first surface of a first substrate;
a first wire having a first portion contacting the first attachment ball and a second portion, the first wire having a sidewall between first and second opposite ends;
a second attachment ball attached to a first surface of a second substrate, the first surface of the second substrate having a face-to-face orientation with the first surface of the first substrate; and
a second wire having a first portion contacting the second attachment ball and a second portion, the second wire having a sidewall between first and second opposite ends, wherein the sidewall of the second portion of the first wire vertically overlaps with and is connected to and in direct physical contact with the sidewall of the second portion of the second wire.